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Techub News reports, citing CryptoBriefing, that SK Hynix has begun receiving Intel's EMIB substrates for integration testing. The two companies are collaborating on 2.5D packaging technology, aiming to more efficiently connect high-bandwidth memory (HBM) with logic chips and reduce dependence on a single wafer foundry.
Intel's EMIB technology currently achieves a yield rate of 90%, becoming an alternative to TSMC's CoWoS. SK Hynix previously announced an investment of $3.9 billion in the United States to build a 2.5D HBM packaging facility. If this technology reduces the production cost of HBM chips, it could ultimately impact the price of crypto mining hardware and miners' profitability.
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Techub News reports, citing CryptoBriefing, that SK Hynix has begun receiving Intel's EMIB substrates for integration testing. The two companies are collaborating on 2.5D packaging technology, aiming to more efficiently connect high-bandwidth memory (HBM) with logic chips and reduce dependence on a single wafer foundry.
Intel's EMIB technology currently achieves a yield rate of 90%, becoming an alternative to TSMC's CoWoS. SK Hynix previously announced an investment of $3.9 billion in the United States to build a 2.5D HBM packaging facility. If this technology reduces the production cost of HBM chips, it could ultimately impact the price of crypto mining hardware and miners' profitability.
如您认为本页面（或本平台）内容存在侵权或违规情形，请您在发现之日起尽快与我们联系，并提供：权利人姓名/名称及联系方式、被侵权作品名称及权属证明、具体侵权链接及情况说明。我们在核实后将及时处理相关内容。
联系方式：creator@techub.news
商务合作：contacting@techub.news
点击链接下载 Techub News App，获取最新讯息：
https://www.techub.news/download
（或扫描下方二维码下载）
All information provided on this website is for reference only. The website does not guarantee the accuracy, validity, timeliness, or completeness of the information. Any actions based on the information provided are at the user’s own risk.
