SK Hynix collaborates with Intel to test 2.5D packaging technology

Techub News reports, citing CryptoBriefing, that SK Hynix has begun receiving Intel's EMIB substrates for integration testing. The two companies are collaborating on 2.5D packaging technology, aiming to more efficiently connect high-bandwidth memory (HBM) with logic chips and reduce dependence on a single wafer foundry. Intel's EMIB technology currently achieves a yield rate of 90%, becoming an alternative to TSMC's CoWoS. SK Hynix previously announced an investment of $3.9 billion in the United States to build a 2.5D HBM packaging facility. If this technology reduces the production cost of HBM chips, it could ultimately impact the price of crypto mining hardware and miners' profitability.